Three-dimensional integrated circuits (3D ICs) have emerged as a groundbreaking technology in the field of biometric authentication systems. Biometric authentication refers to the use of unique physiological or behavioral characteristics, such as fingerprints, iris patterns, or voice recognition, to verify the identity of individuals. With the increasing demand for secure and reliable authentication methods, 3D ICs offer significant advantages over traditional two-dimensional (2D) circuits. In a biometric authentication system, accuracy and speed are of paramount importance. 3D IC enable the integration of multiple components, such as sensors, processors, and memory, into a compact and vertically stacked architecture. This vertical integration minimizes interconnect lengths and reduces signal delays, leading to faster data processing and improved system performance. Furthermore, the proximity of components enhances the signal quality, resulting in higher accuracy in capturing and processing biometric data.

Another advantage of 3D ICs in biometric authentication systems is their ability to handle large amounts of data. Biometric systems generate and process substantial data, including high-resolution images or complex algorithms. The increased interconnect density and shorter signal paths in 3D IC enable efficient data transfer between different functional blocks, reducing latency and enhancing overall system throughput. This is particularly crucial in time-critical applications, such as real-time face recognition or fingerprint matching. Additionally, 3D IC offer enhanced security features for biometric authentication systems. By integrating different components in close proximity, it becomes more challenging for unauthorized entities to tamper with or intercept sensitive data. The reduced vulnerability to physical attacks, such as side-channel attacks or reverse engineering, makes 3D IC an attractive choice for ensuring the privacy and integrity of biometric information.