The development trend of thin and light consumer electronic products such as smartphones and wearable devices is accelerating, and the core components of such products are also becoming more sophisticated and complex. In this context, the application prospects of the MIM process are becoming increasingly clear. At present, the process has been widely used in the manufacture of MIM communication parts such as card trays, camera rings, buttons, connector joints, built-in structural parts, watch cases, and buckles. http://www.chinamim.com/mim-communication-parts/

The development trend of thin and light consumer electronic products such as smartphones and wearable devices is accelerating, and the core components of such products are also becoming more sophisticated and complex. In this context, the application prospects of the MIM process are becoming increasingly clear. At present, the process has been widely used in the manufacture of MIM communication parts such as card trays, camera rings, buttons, connector joints, built-in structural parts, watch cases, and buckles. http://www.chinamim.com/mim-communication-parts/